Qualcomm Sdm845 Snapdragon 845 10 Nm


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Snapdragon 845
Scrap bundle, front
Full general Info
Designer Qualcomm,
ARM Holdings
Manufacturer Samsung
Model Number SDM845
Part Number SDM845
Introduction December half dozen, 2017 (announced)
February, 2018 (launched)
General Specs
Family Snapdragon 800
Series 800
Frequency 2,800 MHz, 1,700 MHz
Microarchitecture
ISA ARMv8.2 (ARM)
Microarchitecture Cortex-A75, Cortex-A55
Core Name Kryo 385 Gold, Kryo 385 Silvery
Process 10 nm
Transistors 5,300,000,000
Technology CMOS
Die 95 mm²
Word Size 64 bit
Cores eight
Threads viii
Max Memory 10 GiB
Multiprocessing
Max SMP 1-Fashion (Uniprocessor)
Packaging
sdm845 (back).png
Succession

Snapdragon 835

Snapdragon 855

Snapdragon 845
is a high-performance 64-chip ARM LTE arrangement on a flake designed past Qualcomm and introduced in late 2017. Fabricated on Samsung’s 10nm 10LPP, the 845 features 4 Kryo 385 Argent high-efficiency cores operating at ane.seven GHz along with four loftier-performance Kryo 385 Gold cores operating at 2.eight GHz. The Snapdragon 845 integrates the Adreno 630 GPU operation at 710 MHz and features an X20 LTE modem supporting True cat thirteen uplink and Cat 18 downlink. This chip supports upwardly to viii GiB of quad-aqueduct LPDDR4X-3733 memory.

Cache

[edit]

Primary manufactures: Cortex-A75 § Cache and Cortex-A55 § Cache


Quad-core cluster Cortex-A75:

[Edit/Modify Enshroud Info]

hierarchy icon.svg

Enshroud Arrangement

Cache
is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of fourth dimension the information it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a big impact on the performance, power consumption, die size, and consequently price of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Annotation: All units are in kibibytes and mebibytes.

L1$
512 KiB

0.5 MiB

524,288 B

4.882812e-iv GiB

L1I$
256 KiB

0.25 MiB

262,144 B

2.441406e-4 GiB

4×64 KiB 4-fashion set associative
L1D$
256 KiB

0.25 MiB

262,144 B

2.441406e-4 GiB

4×64 KiB iv-way set associative

L2$
1 MiB

1,024 KiB

1,048,576 B

9.765625e-4 GiB

4×256 KiB 8-mode set associative

Quad-core cluster Cortex-A55:

[Edit/Modify Cache Info]

hierarchy icon.svg

Cache Organization

Enshroud
is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU past preparing ahead of time the data it needs to read from a relatively slower medium such every bit principal memory.

The organisation and amount of enshroud can have a large impact on the operation, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-cake size, and fetch and write-dorsum policies.

Annotation: All units are in kibibytes and mebibytes.

L1$
512 KiB

0.5 MiB

524,288 B

4.882812e-4 GiB

L1I$
256 KiB

0.25 MiB

262,144 B

2.441406e-4 GiB

4×64 KiB 2-fashion set up associative
L1D$
256 KiB

0.25 MiB

262,144 B

2.441406e-four GiB

4×64 KiB four-way fix associative

L2$
512 KiB

0.v MiB

524,288 B

4.882812e-4 GiB

4×128 KiB 8-way set associative
  • 2 MiB L3

Memory controller

[edit]

[Edit/Change Memory Info]

ram icons.svg

Integrated Retention Controller

Max Type LPDDR4X-3833
Supports ECC No
Max Mem 8 GiB
Frequency 1866 MHz
Controllers 1
Channels 4
Width sixteen bit
Max Bandwidth
29.87 GiB/s

51.974 GB/s

30,586.88 MiB/south

0.0292 TiB/s

0.0321 TB/s

Bandwidth

Single
7.47 GiB/s

Double
14.93 GiB/s

Quad
29.87 GiB/s

DSP

[edit]

This chip features Qualcomm’due south Hexagon 685 DSP.

Graphics

[edit]

  • UHD video playback/encoding @ 4K (3840×2160) 60fps, 10bit HDR, Rec 2020 color gamut
  • Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) upward to 240fps
  • H.264 (AVC), H.265 (HEVC), VP9, DisplayPort over USB Type-C back up

Sound

[edit]

  • Qualcomm Aqstic audio codec and speaker amplifier
  • Qualcomm aptX sound playback with support for aptX Archetype and Hard disk
  • Native DSD support, PCM up to 384kHz/32bit

Photographic camera

[edit]

  • Prototype Indicate Processor

    • Qualcomm Spectra 280
    • New compages for 14-bit image signal processing, with support for upwards to:

      • Single HFR 16 MPix camera at 60fps ZSL
      • Dual 16 MPix cameras at 30fps ZSL
      • Single 32 MPix camera at 30fps ZSL
    • Tin connect upwardly to 7 different cameras (many configurations possible)

      • Multi-frame Dissonance Reduction (MFNR) with accelerated epitome stabilization
      • Hybrid Autofocus with support for dual phase detection (2PD) sensors
      • Ultra HD Premium video capture @ 4K (3840×2160) 60fps, 10bit HDR, Rec 2020 colour gamut
      • College quality video capture with Motility Compensated Temporal Filtering (MCTF)
      • 3D structured calorie-free agile depth sensing, with accelerated face up detection/recognition

Connectivity

[edit]

  • X20 LTE Modem

    • Downlink:

      • LTE Cat eighteen up to ane.2 Gbps, 5×20 MHz carrier aggregation, upwards to 256-QAM, up to 4×4 MIMO on 3 carriers
    • Uplink:

      • LTE True cat 13 up to 150 Mbps, Upload+ (2×20 MHz carrier aggregation, up to 64-QAM)
    • License Assisted Access (LAA)
    • Citizens Broadband Radio Service (CBRS) shared radio spectrum
    • Dual SIM Dual VoLTE (DSDV)
    • All Manner with support for all major cellular modes plus LAA.

      • VoLTE with SRVCC to 3G and 2G, Hd and Ultra Hard disk Voice (EVS), CSFB to 3G and 2G
      • Vocalisation over Wi-Fi (VoWiFi) with LTE call continuity
  • Wi-Fi

    • 802.11ad Multi-gigabit with lx GHz diversity module
    • 802.11ac 2×2 with MU-MIMO
    • Tri-ring Wi-Fi: two.4 GHz and 5 GHz with Dual-Band Simultaneous (DBS) + 60 GHz
    • 11k/r/five: Enhanced mobility, fast acquisition and congestion mitigation for Carrier Wi-Fi
  • Bluetooth

    • Bluetooth 5.0

      • Proprietary enhancements

        • Ultra-low power wireless earbuds
        • Directly audio broadcast to multiple devices

Location

[edit]

  • Systems: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
  • Low Power Geofencing and Tracking, Sensor-assisted Navigation

Utilizing devices

[edit]

  • Asus Zenfone 5Z
  • Comma Three
  • Google Pixel 3
  • Google Pixel iii XL
  • HTC U12+
  • LG G7 ThinQ
  • LG V35 ThinQ
  • LG V40 ThinQ
  • Nokia 9 PureView
  • OnePlus 6
  • OnePlus 6T
  • Oppo Find X
  • Razer Phone 2
  • Samsung Galaxy Note9
  • Samsung Galaxy S9
  • Samsung Milky way S9+
  • Shift 6mq
  • Sony Xperia XZ2
  • Sony Xperia XZ2 compact
  • Sony Xperia XZ2 Premium
  • Sony Xperia XZ3
  • Xiaomi Mi Mix 3
  • Xiaomi Mi Mix 2s
  • Xiaomi Mi viii
  • Xiaomi Pocophone F1
  • ZTE Axon nine Pro

This list is incomplete; y’all tin assistance past expanding information technology.

Die

[edit]

  • Samsung 10nm 10LPP
  • 95 mm²
Die photo by TechInsights
845 die shot.png

Documents

[edit]

  • SDM845 Production Brief
  • SDM 845 connectivity presentation
  • Architecture deep dive
  • Mobile security experiences with Snapdragon 845

back paradigm File:sdm845 (back).png
+
base frequency 2,800 MHz (2.8 GHz, 2,800,000 kHz)
+
and 1,700 MHz (1.7 GHz, 1,700,000 kHz)
+
core count viii
+
core name Kryo 385 Gold
+
and Kryo 385 Silver
+
designer Qualcomm
+
and ARM Holdings
+
die expanse 95 mm² (0.147 in², 0.95 cm², 95,000,000 µm²)
+
dsp Hexagon 685 DSP
+
family unit Snapdragon 800
+
get-go appear December half-dozen, 2017
+
outset launched February 2018
+
full folio name qualcomm/snapdragon 800/845
+
has ecc retention support imitation
+
instance of microprocessor
+
integrated gpu Adreno 630 GPU
+
integrated gpu base of operations frequency 710 MHz (0.71 GHz, 710,000 KHz)
+
integrated gpu designer Qualcomm
+
integrated gpu execution units 2 (256×2 ALU)
+
isa ARMv8.two
+
isa family unit ARM
+
l1$ size 0.5 MiB (512 KiB, 524,288 B, 4.882812e-four GiB)
+
l1d$ description 4-way set up associative
+
l1d$ size 0.25 MiB (256 KiB, 262,144 B, 2.441406e-iv GiB)
+
l1i$ description four-way gear up associative
+
and 2-manner set associative
+
l1i$ size 0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB)
+
l2$ description 8-fashion ready associative
+
l2$ size 1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB)
+
and 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB)
+
ldate Feb 2018
+
principal image File:sdm845 (front).png
+
chief image caption Chip package, front
+
manufacturer Samsung
+
max cpu count 1
+
max memory ten,240 MiB (x,485,760 KiB, 10,737,418,240 B, 10 GiB, 0.00977 TiB)
+
max memory bandwidth 29.87 GiB/s (51.974 GB/southward, xxx,586.88 MiB/south, 0.0292 TiB/s, 0.0321 TB/southward)
+
max memory channels 4
+
microarchitecture Cortex-A75
+
and Cortex-A55
+
model number SDM845
+
name Snapdragon 845
+
function number SDM845
+
process 10 nm (0.01 μm, 1.0e-five mm)
+
serial 800
+
smp max ways 1
+
supported memory type LPDDR4X-3833
+
technology CMOS
+
thread count 8
+
transistor count 5,300,000,000
+
used past Asus Zenfone 5Z
+, Comma Three
+, Google Pixel 3
+, Google Pixel 3 XL
+, HTC U12+
+, LG G7 ThinQ
+, LG V35 ThinQ
+, LG V40 ThinQ
+, Nokia 9 PureView
+, OnePlus 6
+, OnePlus 6T
+, Oppo Notice Ten
+, Razer Telephone 2
+, Samsung Milky way Note9
+, Samsung Galaxy S9
+, Samsung Galaxy S9+
+, Shift 6mq
+, Sony Xperia XZ2
+, Sony Xperia XZ2 compact
+, Sony Xperia XZ2 Premium
+, Sony Xperia XZ3
+, Xiaomi Mi Mix 3
+, Xiaomi Mi Mix 2s
+, Xiaomi Mi viii
+, Xiaomi Pocophone F1
+
and ZTE Axon 9 Pro
+
give-and-take size 64 fleck (8 octets, 16 nibbles)
+

Source: https://en.wikichip.org/wiki/qualcomm/snapdragon_800/845